I. Laesense ea ho Khanna
| Boholo | Thepa | Polokelo ea lintlha |
| 85.8mm x 54mm x 0.76mm (EN 137/1 e tloaelehileng) | Polasetiki ea polycarbonate e nang le lesela le sa senyeheng | Chip ea RFID (tekanyetso ea ISO 18000-6C. Chip ea RFID (tekanyetso ea ISO 18000-6C, mofuta oa koloi o lumelletsoeng o bolokiloe); barcode ea 1D (e na le tlhahisoleseling ea ho ntšoa). Chip ea RFID (tekanyetso ea ISO 18000-6C, mofuta oa laesense ea mabenkele); barcode ea 1D (e na le tlhahisoleseling ea ho ntšoa) |
2.Tshebetso Tlhaloso
(1) Enke e fetolang 'mala o bonahalang (gradient e tala-khauta-tšoeu bakeng sa mongolo oa RDW)
(2) Liholograma (folakha ea EU, e bonahalang tlas'a maemo a itseng a khanya)
(3) Mongolo o monyane (pina ea sechaba ea Madache, jj., e ka bonoang ka khalase e holisang)

Template ea laesense ea ho khanna ea Fora Template ea laesense ea ho khanna ea Jeremane
(II) Russia
1. Tekheniki lintlha
| Litekanyo | Thepa | Polokelo ea lintlha |
| 85.6mm× 54mm(ID-1 st le d) | Polycarbonate e nang le elektroniki e hahiloeng ka har'a sesebelisoa | RFIDchip (contactlessreading); 2Dbarcode (data e patiloeng, netefatso ea lisebelisoa tse khethehileng) |
2. Tshebetso Tlhaloso
(1) Ho betla ka laser (setšoantšo le lipalo, ho ama le ho bonahala)
(2) Enke ea UV (leseli la UV le senola tlhahisoleseling e patiloeng)
Laesense ea ho khanna ea Russia
(III)) Kopanetsoe Linaha
1. Tekheniki Liparamente
| Litekanyo | Thepa | Polokelo ea lintlha |
| Linaha tse ngata li sebelisa 85.6mm x 54mm (mohlala, California), 'me tse ling li sebelisa 216mm x 95mm (mohlala Texas) | PVC kapa polycarbonate e nang le lesira le bonahalang le sa bonahaleng | Mothapo oa makenete (o tlosoang ka mokhoa o itseng) kapa chip ea RFID (mohlala, Texas); barcode ea 1D (ho rekota tlhahisoleseling ea tokollo) Khoutu (ho rekota tlhahisoleseling ea tokollo) |
2. Tshebetso Tlhaloso
(1) Pampiri ea tšireletso (e na le likhoele tse khanyang tse khubelu, tse putsoa le tse tala, tse bonahalang tlas'a khanya ea UV)
(2) Enke ea photochromic (semelo sa foto se fetola 'mala)
(3) Hologram ea laser (paterone ea lefito la khotso)
Template ea laesense ea ho khanna ea US (ha e ea etsoa ka mokhoa o tloaelehileng ho pholletsa le linaha)
(IV) Karolo e Kholo Linaha tsa Asia
1. India
(1)Tekheniki Liparamente
| Boholo | Thepa | Polokelo ea lintlha |
| Tekanyetso ea machaba ea ID-1 (85.6 x 54mm), e lekanang le karete ea banka | Polycarbonate kapa PVC e nang le lesira le sa tsofaleng, linaha tse ling (mohlala, Delhi) li sebelisa chip-on-chip.()Mebuso e meng (mohlala, Delhi) e sebelisa likarete tsa Smart tse sebelisang chip | Chip ea NFC e kentsoeng (ISO 14443) bakeng sa ho bala ntle le ho ama; Khoutu ea bare ea 1D Chip ea NFC e kentsoeng (tekanyetso ea ISO 14443) bakeng sa ho bala ntle le ho ama; barcode ea 1D |
Template ea Laesense ea ho Khanna ea India
(2)Tlhaloso ea Ts'ebetsoione
1)Pampiri e sireletsehileng: E na le likhoele tse khanyang tse bontšang mekhoa e itseng tlas'a khanya ea UV.
2) Hologram ea laser: linaha tse ling (mohlala, Karnataka) li sebelisa filimi ea holographic e matla e bontšang seaparo sa India le mongolo oa "Drivi2ng License".
3)Microtext: Microtext (mohlala, "INDIA") e hatisitsoeng moeling oa foto kapa sebakeng se ka morao seo 3
4)Ho patala khoutu ea QR: ho boloka tlhahisoleseling ea motheo mabapi le mong'a laesense le kakaretso ea data ea biometric, e ka skenoang le ho netefatsoa ke lisebelisoa tsa ts'ebetso ea molao.
2. Japane:
(1) Tekheniki Liparamente
| Litekanyo | Thepa | Polokelo ea lintlha |
| 85.6mm × 54mm | Polycarbonate e nang le chip ea IC e hahiloeng kahare | Chip ea IC (FIPS140-2 e patiloeng, e tšehetsang NFC)ICchip (e patiloeng ka mokhoa oa FIPS140-2, e tšehetsa ho bala ha NFC) |
Template ea Laesense ea ho Khanna ea Japane
(2) Tlhaloso ea ts'ebetso: ho betla ka laser, khoutu ea QR e patiloeng.
(3) Kopanyo ea Laesense ea ho Khanna ea Tšireletso ea Sechaba: Ho qala ka Hlakubele 2025, tlhahisoleseding ea laesense ea ho khanna e tla
e ka kopanngoa le Karete ea Nomoro ea Ka ea Nomoro ho tšehetsa ho hokahanya liphetoho tsa aterese, ho ithuta lithuto tsa inthanete, le ho fana ka likhetho bakeng sa mangolo a setso a ho khanna, mangolo a elektroniki a ho khanna a ts'ireletso ea sechaba, kapa ka bobeli.
3. Boroa Korea:
(1)Tekheniki Liparamente
| Litekanyo | Thepa | Polokelo ea lintlha |
| 85.6mm × 54mm | PVC e nang le filimi e thibelang lintho tsa maiketsetso | Mohala oa makenete kapa chip ea RFID |
(2)Tlhaloso ea ts'ebetso: hologram, watermark, enke ea UV.
4. Singapore:
(1)Tekheniki Liparamente
| Boholo | Thepa | Polokelo ea lintlha |
| 85.6mm x 54mm | Polycarbonate e nang le chip e hahiloeng kahare | Chip (mabenkele a lumellang mofuta oa ho khanna le ho khanna |
rekoto ea ho khanna)
(2)Tshebetso tlhaloso: ho betla ka laser, lihologram
Template ea Laesense ea ho Khanna ea Singapore